ULTRASONIC TEST EQUIPMENT

ULTRASONIC TEST EQUIPMENT .
Phased Array (PA) Modality:
1.    Fully parallel 32:32 PA electronics expandable to 64:64 / 128:128 functionality
2.    1 or 2 PA probe terminals: 1 X 32:32 only or 1 X 32:32 / 2 X 16:16 - switchable: there is no external splitter required for operating 2 PA probes simultaneously
3.    Ability of work with PA probes carrying up to 64 and 128 elements
4.    Independently adjustable emitting and receiving aperture with parallel firing, A/D conversion, and on-the-fly real time digital phasing
5.    Phased array pulser receiver with image guided ray tracing / scan plan designer for the numerous types of simple and complex geometry welds, shafts, bolts, spindles, composite profiles, and the like 8192 independently adjustable focal laws
6.    Bi-polar square wave initial pulse: up to 300 Vpp / 100 dB analogue gain / 0.2...25 MHz bandpass / 16 bit 100 MHz ADC / 32 taps smoothly tunable digital filter
7.    Regular and volume overlay B-Scan / Sector Scan (S-Scan) / Horizontal Plane S-Scan (CB-Scan) coverage accompanied with all-codes-compliant A-Scan based evaluation
8.    Multigroup coverage composed of several cross-sectional B- and S-Scans
9.    Strip Chart
10.    Single group and multigroup Top (C-Scan), Side, End View imaging formed through encoded / time-based line scanning, 3D-Viewer
11.    Single side / both sides weld coverage with use of one PA probe / pair of PA probes
12.    TOFD Map out of a pair of PA probes
13.    Top (C-Scan), Side, End View imaging formed through encoded XY- scanning, 3D-Viewer
14.    Built-in automatic coupling monitor and lamination checker for wedged probes
15.    Equalized cross sectional coverage sensitivity: TCG-independent gain per focal law adjustment providing pure angle gain compensation for S-Scan, etc
16.    DAC, TCG
17.    Dynamic Focusing
18.    FMC, TFM, Back Diffraction Technique with / without and Mode Conversion
19.    Processing of diffracted and mode converted signals for defects sizing and pattern recognition
20.    Operating 2D-array probes
21.    100% raw data capturing
22.    Automatic alarming defects / generating of editable defects list upon scanning completed
23.    Advanced defects sizing and pattern recognition utilities.